Printed Circuit Board ke lejoe la sekhutlo la lihlahisoa tsa elektroniki, ho bohlokoa haholo hore lihlahisoa tsa hau li ka sebetsa ka mokhoa o tsitsitseng nako e telele kapa che.Joaloka moetsi oa Seboka sa PCB le PCB, PCBFuture e beha boleng bo phahameng ho boleng ba liboto tsa potoloho.
PCBFuture qala ho tloha PCB Fabrication khoebo, ka nako eo atolosa ho PCB kopano le likarolo sourcing ditshebeletso, hona joale e se e le e mong oa molemo ka ho fetisisa turnkey PCB mohlahisi kopano.Re etsa matsapa a mangata a ho tsetela ho lisebelisoa tse tsoetseng pele bakeng sa theknoloji e betere, sistimi e ntlafalitsoeng ea kahare bakeng sa ts'ebetso e ntle, ho matlafatsa basebetsi bakeng sa litsebo tse betere.
| Tshebetso | Ntho | Bokhoni ba Ts'ebetso | |
| Lintlha tsa Motheo | Bokhoni ba Tlhahiso | Palo ea lera | Likarolo tse 1-30 |
| Inamela le ho sotha | 0.75% e tloaelehileng, 0.5% e tsoetseng pele | ||
| Min.boholo ba PCB bo felile | 10 x 10mm(0.4 x 0.4") | ||
| Max.boholo ba PCB bo felile | 530 x 1000mm(20.9 x 47.24 ") | ||
| Multi-press bakeng sa foufetseng / patoa vias | Multi-press Cycle≤3 makhetlo | ||
| E felile boto botenya | 0.3 ~ 7.0mm(8 ~ 276mil) | ||
| E felile boto botenya mamello | +/- 10% e tloaelehileng, +/-0.1mm e tsoetseng pele | ||
| Qetello ea bokaholimo | HASL, HASL ea mahala, khauta ea Flash, ENIG, ho roala khauta e thata, OSP, Tin ea ho qoelisoa, silevera ea ho qoelisoa, joalo-joalo. | ||
| Qetello ea holimo e khethiloeng | ENIG+Monoana oa Khauta, Monoana oa Khauta oa Flash+Monoana oa Khauta | ||
| Mofuta oa Boitsebiso | FR4, Aluminium, CEM, Rogers, PTFE, Nelco, Polyimide/Polyester, joalo-joalo. | Hape o ka reka lisebelisoa joalo ka kopo | |
| Foil ea koporo | 1/3oz ~ 10oz | ||
| Mofuta oa Prepreg | FR4 Prepreg, LD-1080(HDI) | 106, 1080, 2116, 7628, joalo-joalo. | |
| Tšepahalang Test | Matla a peel | 7.8N/cm | |
| Fammability | 94V-0 | ||
| Tšilafalo ea Ionic | ≤1ug/cm² | ||
| Min.botenya ba dielectric | 0.075mm(3mil) | ||
| Mamello ea impedance | +/- 10%, min e ka laola +/- 7% | ||
| Lera le ka hare le Fetisetso ya Setshwantsho sa Lera la Kantle | Bokhoni ba Mochini | Mochini oa ho Scrubbing | Botenya ba thepa: 0.11 ~ 3.2mm(4.33mil ~ 126mil) |
| Boholo ba lintho tse bonahalang: min.228 x 228mm(9 x 9") | |||
| Laminator, Exposer | Botenya ba thepa: 0.11 ~ 6.0mm(4.33 ~ 236mil) | ||
| Boholo ba thepa: min 203 x 203mm(8 x 8"), boholo. 609.6 x 1200mm(24 x 30 ") | |||
| Etching Line | Botenya ba thepa: 0.11 ~ 6.0mm(4.33mil ~ 236mil) | ||
| Boholo ba lintho tse bonahalang: min.177 x 177mm(7 x 7") | |||
| Ka hare lera Bokhoni ba Tshebetso | Min.bophara ba mela/sebaka sa ka hare | 0.075/0.075mm(3/3mil) | |
| Min.sekgeo ho tloha mokoting wa lesoba ho ya ho conductive | 0.2mm(8mil) | ||
| Min.selikalikoe se ka hare sa annular | 0.1mm(4mil) | ||
| Min.sebaka se ka hare sa ho itšehla thajana | 0.25mm(10mil) e tloaelehileng, 0.2mm (8mil) e tsoetseng pele | ||
| Min.sebaka sa ho tloha botong ho ya ho conductive | 0.2mm(8mil) | ||
| Min.bophara ba lekhalo pakeng tsa mobu oa koporo | 0.127mm(5mil) | ||
| Botenya ba koporo bo sa leka-lekaneng bakeng sa mantlha a ka hare | H/1oz, 1/2oz | ||
| Max.botenya bo felileng ba koporo | 10oz | ||
| Bokhoni ba Ts'ebetso ea lera la kantle | Min.bophara ba mola o kantle/sebaka | 0.075/0.075mm(3/3mil) | |
| Min.boholo ba sekoti sa lesoba | 0.3mm(12mil) | ||
| Bokhoni ba Ts'ebetso | Max.sekotjana tente boholo | 5 x 3mm(196.8 x 118mil) | |
| Max.tente ea lesoba boholo | 4.5mm(177.2mil) | ||
| Min.ho tente bophara ba naha | 0.2mm(8mil) | ||
| Min.selikalikoe sa annular | 0.1mm(4mil) | ||
| Min.Sekhahla sa BGA | 0.5mm(20mil) | ||
| AOI | Bokhoni ba Mochini | Orbotech SK-75 AOI | Botenya ba thepa: 0.05 ~ 6.0mm(2 ~ 236.2mil) |
| Boholo ba lintho tse bonahalang: max.597 ~ 597mm(23.5 x 23.5") | |||
| Mochini oa Orbotech Ves | Botenya ba thepa: 0.05 ~ 6.0mm(2 ~ 236.2mil) | ||
| Boholo ba lintho tse bonahalang: max.597 ~ 597mm(23.5 x 23.5") | |||
| Ho phunya | Bokhoni ba Mochini | Mochine oa MT-CNC2600 Drill | Botenya ba thepa: 0.11 ~ 6.0mm(4.33 ~ 236mil) |
| Boholo ba lintho tse bonahalang: max.470 ~ 660mm(18.5 x 26") | |||
| Min.boholo ba ho cheka: 0.2mm(8mil) | |||
| Bokhoni ba Ts'ebetso | Min.mefuta e mengata ea ho cheka | 0.55mm(21.6mil) | |
| Max.karo-karolelano (boholo bo felileng VS Drill boholo) | 12:01 | ||
| Mamello ea sebaka sa lesoba (ha e bapisoa le CAD) | +/-3mil | ||
| Counterbore lesoba | PTH & NPTH, Top angle 130 °, Top bophara <6.3mm | ||
| Min.sekgeo ho tloha mokoting wa lesoba ho ya ho conductive | 0.2mm(8mil) | ||
| Max.cheka boholo bo nyane | 6.5mm(256mil) | ||
| Min.multi-hit slot boholo | 0.45mm(17.7mil) | ||
| Ho mamella boholo ba lesoba bakeng sa ho lekana ha khatiso | +/-0.05mm(+/-2mil) | ||
| Min.PTH slot boholo mamello | +/-0.15mm(+/-6mil) | ||
| Min.NPTH slot boholo mamello | +/-2mm(+/-78.7mil) | ||
| Min.sebaka ho tloha ho lesoba ho ea ho conductive(Blind vias) | 0.23mm(9mil) | ||
| Min.boholo ba laser drill | 0.1mm(+/-4mil) | ||
| Countersink Hole angle & Diameter | Holimo 82,90,120° | ||
| Ts'ebetso ea Metsi | Bokhoni ba Mochini | Panel & Pattern plating line | Botenya ba thepa: 0.2 ~ 7.0mm(8 ~276mil) |
| Boholo ba lintho tse bonahalang: max.610 x 762mm(24 x 30") | |||
| Deburring Maching | Botenya ba thepa: 0.2 ~ 7.0mm(8 ~276mil) | ||
| Boholo ba lintho tse bonahalang: min.203 x 203mm(8" x 8") | |||
| Desmear Line | Botenya ba thepa: 0.2mm ~ 7.0mm(8 ~276mil) | ||
| Boholo ba lintho tse bonahalang: max.610 x 762mm(24 x 30") | |||
| Mohala oa tin plating | Botenya ba thepa: 0.2 ~ 3.2mm(8 ~126mil) | ||
| Boholo ba lintho tse bonahalang: max.610 x 762mm(24 x 30") | |||
| Bokhoni ba Ts'ebetso | Sekoti lebota botenya ba koporo | karolelano ea 25um(1mil) e tloaelehileng | |
| E qetile botenya ba koporo | ≥18um(0.7mil) | ||
| Bophara ba mola o monyenyane bakeng sa ho tšoaea etching | 0.2mm(8mil)) | ||
| Max.e qetile boima ba koporo bakeng sa likarolo tse ka hare le tsa ka ntle | 7oz | ||
| Botenya bo fapaneng ba koporo | H/1oz,1/2oz | ||
| Mask ea Solder & Silkscreen | Bokhoni ba Mochini | Mochini oa ho Scrubbing | Botenya ba thepa: 0.5 ~ 7.0mm(20 ~ 276mil) |
| Boholo ba lintho tse bonahalang: min.228 x 228mm(9 x 9") | |||
| Mohlahisi | Botenya ba thepa: 0.11 ~ 7.0mm(4.3 ~ 276mil) | ||
| Boholo ba lintho tse bonahalang: max.635 x 813mm(25 x 32") | |||
| Hlahisa mochine | Botenya ba thepa: 0.11 ~ 7.0mm(4.3 ~ 276mil) | ||
| Boholo ba lintho tse bonahalang: min.101 x 127mm(4 x 5") | |||
| Mmala | 'Mala oa mask oa solder | Botala, botala ba matte, bosehla, botšo, boputsoa, bokhubelu, bosoeu | |
| 'Mala oa silika | E tšoeu, e mosehla, e ntšo, e putsoa | ||
| Solder Mask Bokhoni | Min.ho bula mask a solder | 0.05mm(2mil) | |
| Max.e hoketsoe ka boholo | 0.65mm(25.6mil) | ||
| Min.bophara bakeng sa khaso ea line ka S/M | 0.05mm(2mil) | ||
| Min.solder mask litšōmo bophara | 0.2mm(8mil) e tloaelehileng, 0.17mm (7mil) e tsoetseng pele | ||
| Min.solder mask botenya | 10um(0.4mil) | ||
| Botenya ba mask a solder bakeng sa ho etsa litente | 10um(0.4mil) | ||
| Min.carbon oil line bophara/sebaka | 0.25/0.35mm(10/14mil) | ||
| Min.setsiba sa carbon | 0.06mm(2.5mil) | ||
| Min.khabone oli line trace | 0.3mm(12mil)) | ||
| Min.sebaka ho tloha ho paterone ea khabone ho isa ho li-pads | 0.25mm(10mil) | ||
| Min.bophara ba ho peelable mask sekoaelo line/pad | 0.15mm(6mil) | ||
| Min.solder mask borokho bophara | 0.1mm(4mil)) | ||
| Solder mask Thata | 6H | ||
| Matla a Mask a Peelable | Min.sebaka ho tloha ho paterone ea mask e peelable ho ea ho pad | 0.3mm(12mil)) | |
| Max.boholo ba lesoba la tente la mask e peelable (Ka khatiso ea skrine) | 2mm(7.8mil) | ||
| Max.boholo ba lesoba la tente la maske le peelable (Ka khatiso ea aluminium) | 4.5 limilimithara | ||
| Botenya ba mask a peelable | 0.2 ~ 0.5mm(8 ~20mil) | ||
| Bokhoni ba Silkscreen | Min.Silkscreen line bophara | 0.11mm(4.5mil) | |
| Min.bophahamo ba line ea silkscreen | 0.58mm(23mil) | ||
| Min.sebaka ho tloha ho tšōmo ho ea ho pad | 0.17mm(7mil) | ||
| Surface Finish | Bokaholimo Qetella Bokhoni | Max.bolelele ba monoana oa khauta | 50mm(2") |
| ENIG | 3 ~ 5um(0.11 ~ 197mil) nickel, 0.025 ~ 0.1um(0.001 ~ 0.004mil) khauta | ||
| monoana oa khauta | 3 ~ 5um(0.11 ~ 197mil) nickel, 0.25 ~ 1.5um(0.01 ~ 0.059mil) khauta | ||
| HASL | 0.4um(0.016mil) Sn/Pb | ||
| Mochini oa HASL | Botenya ba thepa: 0.6 ~ 4.0mm(23.6 ~ 157mil) | ||
| Boholo ba thepa: 127 x 127mm ~ 508 x 635mm(5 x 5" ~ 20 x 25") | |||
| Ho roala khauta e thata | 1-5u" | ||
| Tin ea ho qoelisoa | 0.8 ~ 1.5um(0.03 ~ 0.059mil) Tin | ||
| Silivera ea ho qoelisoa | 0.1 ~ 0.3um(0.004 ~ 0.012mil) Ag | ||
| OSP | 0.2 ~ 0.5um(0.008 ~ 0.02mil) | ||
| Teko ea E | Bokhoni ba Mochini | Mohlahlobi o fofang oa probe | Botenya ba thepa: 0.4 ~ 6.0mm(15.7 ~ 236mil) |
| Boholo ba lintho tse bonahalang: max.498 x 597mm(19.6 ~ 23.5") | |||
| Min.sebaka sa ho tloha sebakeng sa teko ho ya ho sephetho sa boto | 0.5mm(20mil) | ||
| Min.conductive resistance | 5Ω | ||
| Max.khanyetso ea insulation | 250mΩ | ||
| Max.motlakase oa teko | 500V | ||
| Min.boholo ba pad pad | 0.15mm(6mil)) | ||
| Min.test pad to pad spacing | 0.25mm(10mil) | ||
| Max.teko jwale | 200mA | ||
| Profileing | Bokhoni ba Mochini | Mofuta oa profil | NC routing, V-cut, slots, lesoba la setempe |
| Mochini oa ho tsamaisa NC | Botenya ba thepa: 0.05 ~ 7.0mm(2 ~ 276mil) | ||
| Boholo ba lintho tse bonahalang: max.546 x 648mm(21.5 x 25.5") | |||
| Mochine oa V-cut | Botenya ba thepa: 0.6 ~ 3.0mm(23.6 ~ 118mil) | ||
| Bophara ba thepa e phahameng bakeng sa V-cut: 457mm(18") | |||
| Bokhoni ba Ts'ebetso | Min.boholo bo nyane ba tsela | 0.6mm(23.6mil) | |
| Min.bolela mamello | +/-0.1mm(+/-4mil) | ||
| Mofuta oa angle oa V-cut | 20°, 30°, 45°, 60° | ||
| V-cut angle tolerance | +/-5° | ||
| Mamello ea ngoliso ea V-cut | +/-0.1mm(+/-4mil) | ||
| Min.karohano ea menoana ea khauta | +/-0.15mm(+/-6mil) | ||
| Bevelling angle tolerance | +/-5° | ||
| Bevelling lula botenya mamello | +/-0.127mm(+/-5mil) | ||
| Min.radius e ka hare | 0.4mm(15.7mil) | ||
| Min.sekgala ho tloha ho conductive ho ya ho kemiso | 0.2mm(8mil) | ||
| Mamello e tebileng ea Countersink/Counterbore | +/-0.1mm(+/-4mil) | ||